AUO to showcase glass core substrate technology at SEMICON Taiwan

TAIPEI (Taiwan News) — AUO Corp. said Monday it will showcase its latest optoelectronics integration and advanced packaging technologies at SEMICON Taiwan this week.

The company will showcase its glass core substrate technology at Corning’s booth, combining Corning’s semiconductor-grade glass materials with AUO’s redistribution layer processing technology, per CNA.

AUO CTO Liao Wei-lun (廖唯倫) said AI is driving demand for greater computing performance while increasing the importance of optical communications and advanced packaging. He said future advances will require closer integration across materials, components, and modules.

AUO said its exhibits will include optical communications technology developed with partners, including a micro LED system designed to send data at high speeds over distances of up to 10 meters in data centers, per TVBS.

AUO will handle the packaging, optical connections, and overall system design, CNA reported. The system will use Micro LED emitters from Ennostar and Micro PD receivers from Tyntek, while AUO plans to use photosensitive insulating materials from Daxin Materials in the packaging.